Yıl: 2021 Cilt: 45 Sayı: 3 Sayfa Aralığı: 719 - 736 Metin Dili: İngilizce DOI: 10.3906/kim-2011-48 İndeks Tarihi: 28-06-2022

Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components

Öz:
Generating power from renewable biogas in solid oxide fuel cells (SOFCs) is an environment-friendly, efficient, and promising energy conversion process. Biogas can be used in SOFCs via a reforming process for which dry reforming is more suitable as the reforming agent exists in the biogas mixture. Biogas can be directly reformed to $H_2$ -rich fuel stream in the anode chamber of a SOFC by the heat released during power generation. Exploiting the heat and water produced in the SOFC for internal reforming of biogas makes the energy conversion process very efficient; however, various challenges are reported. Thus, indirect internal reforming is opted for which a separate reforming domain is required. In an indirect internal reformer operating at usual conditions, dry reforming rate is quite high in the inlet and it decreases steeply toward the fuel outlet. Great temperature gradients develop over the reformer, since the dry reforming reaction is strongly endothermic. The abruptly varying rate of the reforming reaction affects the temperature fields in the adjacent components of SOFC and hence intolerable thermal stresses emerge on the SOFC components. In our preceding study, we graded the reforming domain, homogenized the temperature profile over the reforming domain, and executed performance and durability experiments. However, most of the experiments failed due to fracturing SOFC components hinting at existence of thermal stresses. In that study, we focused on minimizing the temperature gradients within the reforming domain; namely, we neglected the other processes. To eliminate the thermal stresses, we modeled the entire module of SOFC equipped with a reformer featuring a graded reforming domain. We found that the mismatch between the thermal conductivities of the adjacent module components is the major reason for the thermal stresses. When the mismatch is eliminated, thermal stresses disappear even if the reforming domain is not graded.
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Belge Türü: Makale Makale Türü: Araştırma Makalesi Erişim Türü: Erişime Açık
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APA AYDIN Ö, MATSUMOTO G, SHIRATORI Y (2021). Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. , 719 - 736. 10.3906/kim-2011-48
Chicago AYDIN Özgür,MATSUMOTO Go,SHIRATORI Yusuke Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. (2021): 719 - 736. 10.3906/kim-2011-48
MLA AYDIN Özgür,MATSUMOTO Go,SHIRATORI Yusuke Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. , 2021, ss.719 - 736. 10.3906/kim-2011-48
AMA AYDIN Ö,MATSUMOTO G,SHIRATORI Y Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. . 2021; 719 - 736. 10.3906/kim-2011-48
Vancouver AYDIN Ö,MATSUMOTO G,SHIRATORI Y Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. . 2021; 719 - 736. 10.3906/kim-2011-48
IEEE AYDIN Ö,MATSUMOTO G,SHIRATORI Y "Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components." , ss.719 - 736, 2021. 10.3906/kim-2011-48
ISNAD AYDIN, Özgür vd. "Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components". (2021), 719-736. https://doi.org/10.3906/kim-2011-48
APA AYDIN Ö, MATSUMOTO G, SHIRATORI Y (2021). Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. Turkish Journal of Chemistry, 45(3), 719 - 736. 10.3906/kim-2011-48
Chicago AYDIN Özgür,MATSUMOTO Go,SHIRATORI Yusuke Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. Turkish Journal of Chemistry 45, no.3 (2021): 719 - 736. 10.3906/kim-2011-48
MLA AYDIN Özgür,MATSUMOTO Go,SHIRATORI Yusuke Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. Turkish Journal of Chemistry, vol.45, no.3, 2021, ss.719 - 736. 10.3906/kim-2011-48
AMA AYDIN Ö,MATSUMOTO G,SHIRATORI Y Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. Turkish Journal of Chemistry. 2021; 45(3): 719 - 736. 10.3906/kim-2011-48
Vancouver AYDIN Ö,MATSUMOTO G,SHIRATORI Y Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components. Turkish Journal of Chemistry. 2021; 45(3): 719 - 736. 10.3906/kim-2011-48
IEEE AYDIN Ö,MATSUMOTO G,SHIRATORI Y "Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components." Turkish Journal of Chemistry, 45, ss.719 - 736, 2021. 10.3906/kim-2011-48
ISNAD AYDIN, Özgür vd. "Thermal stresses in SOFC stacks: the role of mismatch among thermal conductivity of adjacent components". Turkish Journal of Chemistry 45/3 (2021), 719-736. https://doi.org/10.3906/kim-2011-48